Content
JUKI Server DF01
❙ Introduce of JUKI Server DF01
■ Supplying a bare chip from a wafer and a waffle tray. |
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Handling a wafer and a waffle tray that are supply types peculiar to bare chips for application such as placement of components mixed with semiconductor. The extended grip ring for a wafer and waffle trays (2" and 4" size) are usable. | ||
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■ Achieving the simultaneous pick using a shuttle and the direct pick using a mounter's head. | ||
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The optimum handling method is selectable according to the intended use; the simultaneous pick of two or more chips through a shuttle when giving priority to productivity, or the direct pick through a mounter's head when giving priority to low damage to the chips. | ||
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■ Attaining a face up and a face down (flip) supplies. | ||
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Only one unit can work for different applications through a face up supply for a wire bonding process or a face down supply for a flip chip process. | ||
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■ Handling multiple chips | ||
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The ten palettes can be stored in a stacker. The application that mounts two or more types of bare chips such as MCM (Multichip Module) or Sip (System in package) is achieved. | ||
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■ Simple quick-release mechanism | ||
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The attachment to a mounter or the detachment from the mounter is easy as well as the exchange with a feeder bank. When a production item changes, this product also responds flexibly. | ||
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■ Quality check | ||
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Bad mark (standard) or mapping data (option) is available to make the good or bad judgment in a wafer. |




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