Ball grid array packaging (English: BGA, Ball Grid Array, hereinafter referred to as BGA) technology is a surface mount packaging technology applied to integrated circuits. This technology is often used to permanently fix devices such as microprocessors. BGA package can provide more pins than other dual in-line package or quad flat package (Quad Flat Package), the bottom surface of the entire device can be used as pins , Instead of only the surroundings can be used, it can have a shorter average wire length than the package type limited by the surroundings, so as to have better high-speed performance.

 

 

BGA packaging technology is improved from pin grid array (PGA). It is a packaging method in which a certain surface is arranged in a grid pattern to cover (or partially cover) the pins. At this time, the electronic signal can be conducted from the integrated circuit to the printed circuit board (PCB) where it is located. In the BGA package, the pins at the bottom of the package are replaced by solder balls, each of which was originally a small solder ball fixed on it. These solder balls can be configured manually or through an automated machine, and positioned by flux. When the device is fixed on the PCB by surface mount technology, the arrangement of the solder balls at the bottom corresponds exactly to the position of the copper foil on the board. The production line then heats it, whether it is placed in a reflow oven or an infrared oven, to dissolve the solder balls. Surface tension will cause the melted solder balls to support the package points and align them on the circuit board. At the correct spacing distance, when the solder balls are cooled and fixed, the solder joints formed can connect the device and the PCB.

 

CABGA: Chip Array Ball Grid Array.

CBGA and PBGA represent that the base material to which the BGA is attached is ceramic or plastic.

CTBGA: Thin Chip Array Ball Grid Array.

CVBGA: Very Thin Chip Array Ball Grid Array.

DSBGA: Die-Size Ball Grid Array.

FBGA: Fine Ball Grid Array is built on BGA technology. It has finer contacts and is mainly used in system single-chip design, which is called FineLine BGA by Altera. It is different from Fortified BGA.

FCmBGA: Flip Chip Molded Ball Grid Array.

LBGA: Low-profile Ball Grid Array.

LFBGA: Low-profile Fine-pitch Ball Grid Array.

MBGA: Micro Ball Grid Array.

MCM-PBGA: Multi-Chip Module Plastic Ball Grid Array.

PBGA: Plastic Ball Grid Array.

SuperBGA (SBGA): Super Ball Grid Array.

TABGA: Tape Array BGA.

TBGA: Thin BGA.

TEPBGA: Thermally Enhanced Plastic Ball Grid Array.

TFBGA: Thin and Fine Ball Grid Array.

UFBGA or UBGA: Ultra Fine Ball Grid Array.