During the SMT production process, various defects will occur. For different products, there will be extremely complicated reasons. Some simple ones can easily find the root cause through past experience, and then there will be more targeted action measures in a short time. It can be solved. However, some parts, such as those that occur during the reflow process, are slow to be detected by humans or testing equipment. After customer feedback, process engineers or quality engineers can analyze them with hindsight, and then use various methods to improve them. At this time, batch defects may have occurred.

 

 

This article summarizes the general process of the SMTI factory, and analyzes the common defects. The engineer has a basic network understanding of the control points of the entire SMT process, and solves the abnormality in the production process faster.

The SMT process has matured decades ago, and the basic operation process, including the reflow of printed patches, has not changed much in the process, but the accuracy and capabilities of the equipment have undergone qualitative changes. The printing station is the source of the entire SMT. A large part of the poor SMT is in printing. The equipment has high precision, but the printing station involves more process parameters, which requires higher identification and control, and a good process window. The various detection functions of the placement machine accuracy and component recognition are more powerful. Under the condition of exerting the maximum ability of the placement machine software, the maintenance status can be guaranteed, and the batch defect generated by the placement station can basically be eliminated. Therefore, when analyzing failures, first compare the occurrence of abnormalities horizontally and vertically, then check the equipment, and then confirm the parameters. Remember, don't make corresponding solutions based on experience, and be sure to let the data speak.